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Global Wafer Slicing Equipment Strategic Research Report
Global Wafer Slicing Equipment Strategic Research Report 2022-2028 by Regions, by Types, by Application
Hard Copy: 3600 USD
PDF Copy (single user): 3600 USD
Multi User License: 5400 USD
Enterprise wide License: 7200 USD
Pages: 115
Tables and Figures: 148
Published Date: Jan. 2022
Publisher:ASSO International Consulting, Inc.
Contact: Email: sales@assointernationalconsulting.com; contact@assointernationalconsulting.com
Summary
More businesses in the market research, data and insights industry are working toward a step change in their speed, efficiency and product innovation. This has led to a wider demand for more sophisticated and integrated solutions to meet the complex needs of larger established businesses and also newer, hyper-growth and technology-driven companies. ASSO's research report helps decision makers gain insight into market conditions and future trends.
To analyze and research the Wafer Slicing Equipment sales, revenue, consumption, status and forecast.
To focus on the key Wafer Slicing Equipment manufacturers and study the sales, value, market share and development plans in next few years.
To define, describe and forecast the market by type, application.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
To strategically profile the key players and comprehensively analyze their growth strategies.
Global Wafer Slicing Equipment Market: Segment Analysis
The research report includes specific segments by region (country), by company, by Type and by Application. This study provides information about the sales and revenue during the historic and forecasted period of 2017 to 2028. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
The major players in global market include
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
Tensun
Geographically, this report is segmented into several key Regions, with production, consumption, revenue, market share and growth rate of Wafer Slicing Equipment in these regions, from 2013 to 2024 (forecast), covering
North America (United States,Canada, Mexico)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia, Other Regions )
Europe (Germany, U.K., France, Italy, Russia, Rest of Europe)
South America (Brazil. Argentina, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, U.A.E, Other Regions)
On the basis of product, the Wafer Slicing Equipment market is primarily split into
Blade Cutting Machine
Laser Cutting Machine
On the basis on the end users/applications, this report covers
Pure Foundry
IDM
OSAT
LED
Photovoltaic
Table of Contents
1 Target Product and Background
1.1 Product Overview Wafer Slicing Equipment
1.2 Research Method
1.3 Data Source
1.4 Project Cycle
1.5 Forecast Data Base & Factor
1.6 Macroeconomic Development Trends
1.7 Impact of COVID-19 on the Economy and Wafer Slicing Equipment Industry
1.7.1 Post-COVID-19 era
1.7.2 The Impact of COVID-19 on Wafer Slicing Equipment Industry
2 Manufacturers Competitive Analysis of Major Players
2.1 Competitive Segmentation Analysis of Key Players
2.2 2017-2022 Key Players Sales Volume and Market Positions
2.3 Key Players Revenue and Market Positions
3 Wafer Slicing Equipment Sales Segment Analysis by Type
3.1 Overview
3.1.1 Blade Cutting Machine
3.1.2 Laser Cutting Machine
3.2 2017-2028 Global Wafer Slicing Equipment Sales Volume Segment Analysis by Type
3.3 2017-2028 Global Wafer Slicing Equipment Revenue Segment Analysis by Type
4 Wafer Slicing Equipment Sales Segment Analysis End User
4.1 Introduction
4.1.1 Pure Foundry
4.1.2 IDM
4.1.4 LED
4.1.5 Photovoltaic
4.2 2017-2028 Global Wafer Slicing Equipment Sales Volume Segment Analysis by End User
4.3 2017-2028 Global Wafer Slicing Equipment Revenue Segment Analysis by End User
5 Wafer Slicing Equipment Market Analysis, by Region by Country
5.1 Global Wafer Slicing Equipment Market Size and Regional Analysis
5.2 Global Wafer Slicing Equipment Retrospective Market Scenario in Revenue by Region: 2017-2022
5.3 North America Market Size and Regional Analysis
5.3.1 North America Sales by Country
5.3.2 North America Wafer Slicing Equipment Revenue by Country
5.4 Europe Market Size and Regional Analysis
5.4.1 Europe Wafer Slicing Equipment Sales by Country
5.4.2 Europe Wafer Slicing Equipment Revenue by Country
5.5 Asia Pacific Market Size and Regional Analysis
5.5.1 Asia Pacific Wafer Slicing Equipment Sales by Region
5.5.2 Asia Pacific Wafer Slicing Equipment Revenue by Region
5.6 South America Market Size and Regional Analysis
5.6.1 South America Wafer Slicing Equipment Sales by Country
5.6.2 South America Wafer Slicing Equipment Revenue by Country
5.7 Middle East and Africa Market Size and Regional Analysis
5.7.1 Middle East and Africa Wafer Slicing Equipment Sales by Country
5.7.2 Middle East and Africa Wafer Slicing Equipment Revenue by Country
6 Wafer Slicing Equipment SWOT and Driving Factor Analysis
6.1 SWOT Analysis
6.2 Marketing Strategy
6.3 Technology Driven Market
6.4 Wafer Slicing Equipment Growth Drivers
6.5 Wafer Slicing Equipment Market Challenges
6.6 Wafer Slicing Equipment Market Restraints
7 Wafer Slicing EquipmentRaw Material Supply and Industry Chain Analysis
7.1 Wafer Slicing Equipment Key Raw Material Supply
7.1.1 Key Raw Materials
7.1.2 Key Suppliers of Raw Materials
7.2 Wafer Slicing Equipment Industrial Chain Analysis and Reconstruction
8 Global Wafer Slicing Equipment Major Manufacturers Analysis
8.1 DISCO
8.1.1 DISCO Corporate Outline
8.1.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.1.3 DISCO Wafer Slicing Equipment Key Product Overview
8.1.4 Wafer Slicing Equipment Key Product Overview
8.1.5 DISCO Business Segmentation SWOT Analysis
8.2 Tokyo Seimitsu
8.2.1 Tokyo Seimitsu Corporate Outline
8.2.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.2.3 Tokyo Seimitsu Wafer Slicing Equipment Key Product Overview
8.2.4 Wafer Slicing Equipment Key Product Overview
8.2.15Tokyo Seimitsu Business Segmentation SWOT Analysis
8.3 GL Tech Co Ltd
8.3.1 GL Tech Co Ltd Corporate Outline
8.3.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.3.3 Wafer Slicing Equipment Key Product Overview
8.3.4 Wafer Slicing Equipment Key Product Overview
8.3.5 GL Tech Co Ltd Business Segmentation SWOT Analysis
8.4 ASM
8.4.1 ASM Corporate Outline
8.4.1 ASM Corporate Outline
8.4.3 Wafer Slicing Equipment Key Product Overview
8.4.4 Wafer Slicing Equipment Key Product Overview
8.4.5 ASM Business Segmentation SWOT Analysis
8.5 Synova
8.5.1 Synova Corporate Outline
8.5.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.5.3 Wafer Slicing Equipment Key Product Overview
8.5.4 Wafer Slicing Equipment Key Product Overview
8.5.5 Synova Business Segmentation SWOT Analysis
8.6 CETC Electronics Equipment Group Co., Ltd.
8.6.1 CETC Electronics Equipment Group Co., Ltd. Corporate Outline
8.6.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.6.3 Wafer Slicing Equipment Key Product Overview
8.6.4 Wafer Slicing Equipment Key Product Overview
8.6.5 CETC Electronics Equipment Group Co., Ltd. Business Segmentation SWOT Analysis
8.7 Shenyang Heyan Technology Co., Ltd.
8.7.1 Shenyang Heyan Technology Co., Ltd. Corporate Outline
8.7.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.7.3 Wafer Slicing Equipment Key Product Overview
8.7.4 Wafer Slicing Equipment Key Product Overview
8.7.5 Shenyang Heyan Technology Co., Ltd. Business Segmentation SWOT Analysis
8.8 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
8.8.1 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Corporate Outline
8.8.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.8.3 Wafer Slicing Equipment Key Product Overview
8.8.4 Wafer Slicing Equipment Key Product Overview
8.8.5 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Business Segmentation SWOT Analysis
8.9 Hi-TESI
8.9.1 Hi-TESI Corporate Outline
8.9.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.9.3 Wafer Slicing Equipment Key Product Overview
8.9.4 Wafer Slicing Equipment Key Product Overview
8.9.5 Hi-TESI Business Segmentation SWOT Analysis
8.10 Tensun
8.10.1 Tensun Corporate Outline
8.10.2 Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
8.10.3 Wafer Slicing Equipment Key Product Overview
8.10.4 Wafer Slicing Equipment Key Product Overview
8.10.5 Tensun Business Segmentation SWOT Analysis
9 Wafer Slicing Equipment Report Conclusion and Strategy
10 Appendix
10.1 Order and After-sales Service
10.2 Author List
10.3 Disclaimer
List of Tables
Table 1. Competitive Segmentation Analysis of Key Players
Table 2. 2017-2022 Key Players Sales Volume and Market Positions (K Units)
Table 3. 2017-2022 Key Players Revenue and Market Positions (US$ Million)
Table 4. Global Wafer Slicing Equipment Market Size Comparison by Type (2022-2028)
Table 5. Analysis of the Distribution of Main Players' Product Types
Table 6. 2017-2028 Global Wafer Slicing Equipment Sales Volume Segment Analysis by Type (K Units)
Table 7. 2017-2028 Global Wafer Slicing Equipment Sales Volume Share by Type
Table 8. 2017-2028 Global Wafer Slicing Equipment Revenue Segment Analysis by Type (US$ Million)
Table 9. Global Wafer Slicing Equipment Revenue Share by Type (2017-2022)
Table 10. Competitive Segmentation Analysis of Key Players
Table 11. Global Wafer Slicing Equipment Market Size Comparison by End User (2022-2028)
Table 12. 2017-2028 Global Wafer Slicing Equipment Sales Volume Segment Analysis by End User (K Units)
Table 13. 2017-2028 Global Wafer Slicing Equipment Sales Volume Share by End User
Table 14. 2017-2028 Global Wafer Slicing Equipment Revenue Segment Analysis by End User (US$ Million)
Table 15. Global Wafer Slicing Equipment Revenue Share by End User (2017-2022)
Table 16. 2017-2028 Global Segment: Wafer Slicing Equipment Sales Volume Market, by Region (K Units)
Table 17. 2017-2028 Global Segment: Wafer Slicing Equipment Sales Volume Market Share, by Region
Table 18. 2017-2028 Global Segment: Wafer Slicing Equipment Revenue Market, by Region (US$ Million)
Table 19. 2017-2028 Global Segment: Wafer Slicing Equipment Revenue Market Share, by Region
Table 20. 2017-2022E North America Segment: Wafer Slicing Equipment Sales Volume Market, by Country (K Units)
Table 21. 2017-2022E North America Segment: Wafer Slicing Equipment Revenue Market, by Country (US$ Million)
Table 22. 2017-2022E Europe Segment: Wafer Slicing Equipment Sales Volume Market, by Country (K Units)
Table 23. 2017-2022E Europe Segment: Wafer Slicing Equipment Revenue Market, by Country (US$ Million)
Table 24. 2017-2022E Asia Pacific Segment: Wafer Slicing Equipment Sales Volume Market, by Country (K Units)
Table 25. 2017-2022E Asia Pacific Segment: Wafer Slicing Equipment Revenue Market, by Country (US$ Million)
Table 26. 2017-2022E South America Segment: Wafer Slicing Equipment Sales Volume Market, by Country (K Units)
Table 27. 2017-2022E South America Segment: Wafer Slicing Equipment Revenue Market, by Country (US$ Million)
Table 28. 2017-2022E Middle East and Africa Segment: Wafer Slicing Equipment Sales Volume Market, by Country (K Units)
Table 29. Middle East and Africa Wafer Slicing Equipment Revenue Market Share in 2021, by Country (% Share)
Table 30. 2017-2022E Middle East and Africa Segment: Wafer Slicing Equipment Revenue Market, by Country (US$ Million)
Table 31. Wafer Slicing Equipment Growth Drivers
Table 32. Key Suppliers of Raw Materials
Table 33. DISCO Corporate Outline
Table 34. DISCO Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 35. DISCO Key Product Overview
Table 36. Tokyo Seimitsu Corporate Outline
Table 37. Tokyo Seimitsu Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 38. Tokyo Seimitsu Key Product Overview
Table 39. GL Tech Co Ltd Corporate Outline
Table 40. GL Tech Co Ltd Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 41. GL Tech Co Ltd Key Product Overview
Table 42. ASM Corporate Outline
Table 43. ASM Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 44. ASM Key Product Overview
Table 45. Synova Corporate Outline
Table 46. Synova Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 47. Synova Key Product Overview
Table 48. CETC Electronics Equipment Group Co., Ltd. Corporate Outline
Table 49. CETC Electronics Equipment Group Co., Ltd. Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 50. CETC Electronics Equipment Group Co., Ltd. Key Product Overview
Table 51. Shenyang Heyan Technology Co., Ltd. Corporate Outline
Table 52. Shenyang Heyan Technology Co., Ltd. Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 53. Shenyang Heyan Technology Co., Ltd. Key Product Overview
Table 54. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Corporate Outline
Table 55. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 56. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Key Product Overview
Table 57. Hi-TESI Corporate Outline
Table 58. Hi-TESI Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 59. Hi-TESI Key Product Overview
Table 60. Tensun Corporate Outline
Table 61. Tensun Breakdown Sales Volume (K Units), Revenue (US$ Million), Price (USD/Unit) and Gross Margin (2018-2022)
Table 62. Tensun Key Product Overview
List of Tables and Figures
Figure 1. Product Picture of Wafer Slicing Equipment
Figure 2. Proportion of GDP of Major Countries in the World in 2018
Figure 3. Figure Projected Growth Profiles for Major Economies – Regression to the Mean
Figure 4. Figure Key Economies’ Share of World GDP in PPP Terms
Figure 5. Global Economic Forecast in 2050
Figure 6. Global GDP Forecast by Region to 2050
Figure 7. Climate Change Impact on Level of GDP in 2050
Figure 8. Economic Impact of COVID-19 on Major Economies in 2021
Figure 9. IMF's Latest Global Economic Forecast by 2022Q1
Figure 10. Comparative Analysis of the Direct Impact of COVID-19 on the Industry (US$ Million)
Figure 11. Characteristics of the Impact of COVID-19 on the Industry
Figure 12. Key Players Revenue Volume Share in 2021
Figure 13. Global Wafer Slicing Equipment Revenue Share by Manufacturers in 2021
Figure 14. Market Size Share Comparison by End User
Figure 15. Global Wafer Slicing Equipment Market Size by Region in 2021
Figure 16. Global Wafer Slicing Equipment Market Size by Region: 2017 VS 2021 VS 2028
Figure 17. Global Wafer Slicing Equipment Market Size 2017-2028 (US$ Million)
Figure 18. Global Wafer Slicing Equipment Market Size 2017-2028 (US$ Million)
Figure 19. 2017-2028 Global Segment: Wafer Slicing Equipment Sales Volume Market Share, by Region
Figure 20. 2017-2028 Global Segment: Wafer Slicing Equipment Revenue Market Share, by Region
Figure 21. North America Wafer Slicing Equipment Key Player Distribution Analysis
Figure 22. North America Wafer Slicing Equipment Revenue Market Share in 2021, by Country (% Share)
Figure 23. Europe Wafer Slicing Equipment Key Player Distribution Analysis
Figure 24. Europe Wafer Slicing Equipment Revenue Market Share in 2021, by Country (% Share)
Figure 25. Asia Pacific Wafer Slicing Equipment Key Player Distribution Analysis
Figure 26. Asia Pacific Wafer Slicing Equipment Revenue Market Share in 2021, by Country (% Share)
Figure 27. South America Wafer Slicing Equipment Key Player Distribution Analysis
Figure 28. South America Wafer Slicing Equipment Revenue Market Share in 2021, by Country (% Share)
Figure 29. Middle East and Africa Wafer Slicing Equipment Key Player Distribution Analysis
Figure 30. Wafer Slicing Equipment Industry SWOT Analysis
Figure 31. Figure Marketing Strategy
Figure 32. Wafer Slicing Equipment Technology Development Trend
Figure 33. Global Stars: The Most Innovative Countries, Ranked by Income Group in 2019
Figure 34. Leading countries by gross research and development (R&D) expenditure worldwide in 2021(in billion U.S. dollars)
Figure 35. Wafer Slicing Equipment Industrial Chain Analysis
Figure 36. FDI, trade, GDP and GVC trends, 1990–2019
Figure 37. World Carbon Dioxide Emissions from 2009 to 2019, by region (in Million Metric Tons of Carbon Dioxide)
Figure 38. Global Energy Structure Evolution Structure
Figure 39. The Evolution of Global Road Vehicles to 2050
Figure 40. DISCO SWOT Analysis
Figure 41. Tokyo Seimitsu SWOT Analysis
Figure 42. GL Tech Co Ltd SWOT Analysis
Figure 43. ASM SWOT Analysis
Figure 44. Synova SWOT Analysis
Figure 45. CETC Electronics Equipment Group Co., Ltd. SWOT Analysis
Figure 46. Shenyang Heyan Technology Co., Ltd. SWOT Analysis
Figure 47. Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. SWOT Analysis
Figure 48. Hi-TESI SWOT Analysis
Figure 49. Tensun SWOT Analysis
ASSO regards each project as the best communication bridge between us and our customers. ASSO solemnly promises that ASSO will treat each project as our most important customer project. We will go all out and never give up. ASSO regards each other's excellence as the purpose of our service. ASSO's services involve regional analysis, market data, player share, market decision-making, marketing and product positioning
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